| # | |
| # Generic thermal sysfs drivers configuration | |
| # | |
| menuconfig THERMAL | |
| tristate "Generic Thermal sysfs driver" | |
| help | |
| Generic Thermal Sysfs driver offers a generic mechanism for | |
| thermal management. Usually it's made up of one or more thermal | |
| zone and cooling device. | |
| Each thermal zone contains its own temperature, trip points, | |
| cooling devices. | |
| All platforms with ACPI thermal support can use this driver. | |
| If you want this support, you should say Y or M here. | |
| if THERMAL | |
| config THERMAL_HWMON | |
| bool | |
| depends on HWMON=y || HWMON=THERMAL | |
| default y | |
| choice | |
| prompt "Default Thermal governor" | |
| default THERMAL_DEFAULT_GOV_STEP_WISE | |
| help | |
| This option sets which thermal governor shall be loaded at | |
| startup. If in doubt, select 'step_wise'. | |
| config THERMAL_DEFAULT_GOV_STEP_WISE | |
| bool "step_wise" | |
| select STEP_WISE | |
| help | |
| Use the step_wise governor as default. This throttles the | |
| devices one step at a time. | |
| config THERMAL_DEFAULT_GOV_FAIR_SHARE | |
| bool "fair_share" | |
| select FAIR_SHARE | |
| help | |
| Use the fair_share governor as default. This throttles the | |
| devices based on their 'contribution' to a zone. The | |
| contribution should be provided through platform data. | |
| config THERMAL_DEFAULT_GOV_USER_SPACE | |
| bool "user_space" | |
| select USER_SPACE | |
| help | |
| Select this if you want to let the user space manage the | |
| lpatform thermals. | |
| endchoice | |
| config FAIR_SHARE | |
| bool "Fair-share thermal governor" | |
| help | |
| Enable this to manage platform thermals using fair-share governor. | |
| config STEP_WISE | |
| bool "Step_wise thermal governor" | |
| help | |
| Enable this to manage platform thermals using a simple linear | |
| config USER_SPACE | |
| bool "User_space thermal governor" | |
| help | |
| Enable this to let the user space manage the platform thermals. | |
| config CPU_THERMAL | |
| tristate "generic cpu cooling support" | |
| depends on CPU_FREQ | |
| select CPU_FREQ_TABLE | |
| help | |
| This implements the generic cpu cooling mechanism through frequency | |
| reduction, cpu hotplug and any other ways of reducing temperature. An | |
| ACPI version of this already exists(drivers/acpi/processor_thermal.c). | |
| This will be useful for platforms using the generic thermal interface | |
| and not the ACPI interface. | |
| If you want this support, you should say Y here. | |
| config SPEAR_THERMAL | |
| bool "SPEAr thermal sensor driver" | |
| depends on PLAT_SPEAR | |
| depends on OF | |
| help | |
| Enable this to plug the SPEAr thermal sensor driver into the Linux | |
| thermal framework | |
| config RCAR_THERMAL | |
| tristate "Renesas R-Car thermal driver" | |
| depends on ARCH_SHMOBILE | |
| help | |
| Enable this to plug the R-Car thermal sensor driver into the Linux | |
| thermal framework | |
| config EXYNOS_THERMAL | |
| tristate "Temperature sensor on Samsung EXYNOS" | |
| depends on (ARCH_EXYNOS4 || ARCH_EXYNOS5) | |
| depends on CPU_THERMAL | |
| help | |
| If you say yes here you get support for TMU (Thermal Management | |
| Unit) on SAMSUNG EXYNOS series of SoC. | |
| config DB8500_THERMAL | |
| bool "DB8500 thermal management" | |
| depends on ARCH_U8500 | |
| default y | |
| help | |
| Adds DB8500 thermal management implementation according to the thermal | |
| management framework. A thermal zone with several trip points will be | |
| created. Cooling devices can be bound to the trip points to cool this | |
| thermal zone if trip points reached. | |
| config DB8500_CPUFREQ_COOLING | |
| tristate "DB8500 cpufreq cooling" | |
| depends on ARCH_U8500 | |
| depends on CPU_THERMAL | |
| default y | |
| help | |
| Adds DB8500 cpufreq cooling devices, and these cooling devices can be | |
| bound to thermal zone trip points. When a trip point reached, the | |
| bound cpufreq cooling device turns active to set CPU frequency low to | |
| cool down the CPU. | |
| endif |