commit | 6ea083b18d39b35730e59587128cfd6f68bd30bc | [log] [tgz] |
---|---|---|
author | Durgadoss R <durgadoss.r@intel.com> | Tue Sep 18 11:05:06 2012 +0530 |
committer | Zhang Rui <rui.zhang@intel.com> | Mon Nov 05 14:00:09 2012 +0800 |
tree | 8837fd244e6bde92938eb10e94351d6ccd40c4a9 | |
parent | f2b4caafd4aa64c9438b0a94af78b127228e6905 [diff] |
Thermal: Add documentation for platform layer data This patch adds documentation for thermal_bind_params and thermal_zone_params structures. Also, adds details on EXPORT_SYMBOL APIs. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>